What are the reasons for the blistering of PC endurance boards? How should we avoid it?
There are usually two reasons that cause blistering on the board: if the PC endurance board is heated for too long/at too high a temperature, the board will blister (if the temperature is too high, the inside will start to melt, and external gas will enter the inside of the board). However, unlike in sheet metal production where the temperature and heating time are controlled by equipment during later processing, it can only be determined manually, so bending generally requires experienced professional workers to complete.
PC polycarbonate sheets themselves absorb moisture (at standard atmospheric pressure, 23 ℃, a water absorption rate of 0.15% with a relative humidity of 50%). Therefore, if the finished endurance sheet is stored for a long time, it often absorbs moisture from the air. If the moisture is not removed before molding, bubbles and misty micropores will appear in the formed product, which will affect its appearance. To avoid abnormal situations caused by moisture, the board should be pre dried at a lower temperature for a period of time before heating and forming. Usually, the moisture can be removed at a temperature setting of 110 ℃~120 ℃, and the water removal temperature should not be higher than 130 ℃ to prevent the board from softening. The duration of removing moisture depends on the moisture content of the board, the thickness of the board, and the drying temperature taken.
If you don't pay attention during hot bending, it's easy to cause blistering and whitening. How can you avoid it? The bending radius is three times the thickness of the plate, and the width of the heating area can be adjusted to obtain different bending radii. For the production of high-precision or large parts, it is recommended to use bending devices with temperature controllers on both sides. A simple shaped bracket can be made to cool the board in place to reduce deflection.
Local heating can cause internal stress in the product, and special attention should be paid to the use of chemicals for hot bent plates. In any case, it is recommended to first make a sample to determine the feasibility of the bending operation and the appropriate process conditions
The duration of removing moisture depends on the moisture content of the board, the thickness of the board, and the drying temperature taken. The dehydrated board can be safely heated to 180~190 ℃ and can be easily deformed.
PC endurance board bending is an essential process in the processing and production of endurance boards. As a production and processing factory, it is necessary to consider which process to choose based on the specific requirements of the product, and control the key points that are prone to problems in order to produce PC endurance board products without bubbles and with standard dimensions!
What are the reasons for the blistering of PC endurance boards? How should we avoid it?
There are usually two reasons that cause blistering on the board: if the PC endurance board is heated for too long/at too high a temperature, the board will blister (if the temperature is too high, the inside will start to melt, and external gas will enter the inside of the board). However, unlike in sheet metal production where the temperature and heating time are controlled by equipment during later processing, it can only be determined manually, so bending generally requires experienced professional workers to complete.
PC (polycarbonate) sheets themselves absorb moisture (at standard atmospheric pressure, 23 ℃, a water absorption rate of 0.15% with a relative humidity of 50%). Therefore, if the finished endurance sheet is stored for a long time, it often absorbs moisture from the air. If the moisture is not removed before molding, bubbles and misty micropores will appear in the formed product, which will affect its appearance. To avoid abnormal situations caused by moisture, the board should be pre dried at a lower temperature for a period of time before heating and forming. Usually, the moisture can be removed at a temperature setting of 110 ℃~120 ℃, and the water removal temperature should not be higher than 130 ℃ to prevent the board from softening. The duration of removing moisture depends on the moisture content of the board, the thickness of the board, and the drying temperature taken.
If you don't pay attention during hot bending, it's easy to cause blistering and whitening. How can you avoid it? The bending radius is three times the thickness of the plate, and the width of the heating area can be adjusted to obtain different bending radii. For the production of high-precision or large parts, it is recommended to use bending devices with temperature controllers on both sides. A simple shaped bracket can be made to cool the board in place to reduce deflection.
Local heating can cause internal stress in the product, and special attention should be paid to the use of chemicals for hot bent plates. In any case, it is recommended to first make a sample to determine the feasibility of the bending operation and the appropriate process conditions
The duration of removing moisture depends on the moisture content of the board, the thickness of the board, and the drying temperature taken. The dehydrated board can be safely heated to 180~190 ℃ and can be easily deformed.
PC endurance board bending is an essential process in the processing and production of endurance boards. As a production and processing factory, it is necessary to consider which process to choose based on the specific requirements of the product, and control the key points that are prone to problems in order to produce PC endurance board products without bubbles and with standard dimensions!